COOLBOX THERMAL PASTE
COOLBOX THERMAL PASTE
Thermal paste with an electrically non-conductive composition and low thermal resistance. Ideal for improving heat transfer between CPUs, memory, graphics chipsets, etc. and cooling solutions, achieving more efficient cooling.
Characteristics:
- Thermal conductivity:> 3.17 W / mk.
- Thermal resistance: <0.0067ºC-in2 / W.
- Operating temperature: -30 ~ 240ºC.
- Weight: 2g or 30g.
Composition:
- Silicone compounds: 30%.
- Carbon compounds: 20%.
- Metal oxides: 50%.