COOLBOX THERMAL PASTE 

Thermal paste with an electrically non-conductive composition and low thermal resistance. Ideal for improving heat transfer between CPUs, memory, graphics chipsets, etc. and cooling solutions, achieving more efficient cooling.

Characteristics:

• Thermal conductivity:> 3.17 W / mk.
• Thermal resistance: <0.0067ºC-in2 / W.
• Operating temperature: -30 ~ 240ºC.
• Weight: 2g or 30g.

Composition:

• Silicone compounds: 30%.
• Carbon compounds: 20%.
• Metal oxides: 50%.